• Low ESR
  • Long Lifetime
  • High ripple current
  • Capacitance
470µF ~ 68000µF
  • Voltage Rated DC
10V ~ 100V
  • Tolerance
±50%
  • Operating Temp
-55°C ~ 105°C
  • Lifetime
8000 @ 105°C
  • RoHS
ROHS

The **FELSIC 105 TFRS** series is an aluminum electrolytic capacitor manufactured according to international standards integrating the ability to withstand high ripple currents, bank capacitor, dc-dc converters, line-operated dc power supplies and energy storage. It offers optimal performance for applications requiring reliability and energy efficiency.
 

Typical applications :

  • Filtering
  • Energy storage
PN
Capacitance
Voltage Rated DC
Tolerance
Operating Temp
RoHS
A763020 4700µF 10V -10% +50% - -
A763021 6800µF 10V -10% +50% - -
A763022 10000µF 10V -10% +50% - -
A763023 15000µF 10V -10% +50% - -
A763024 22000µF 10V -10% +50% - -
A763025 33000µF 10V -10% +50% - -
A763026 47000µF 10V -10% +50% - -
A763027 68000µF 10V -10% +50% - -
A763040 3300µF 16V -10% +50% - -
A763041 4700µF 16V -10% +50% - -
A763042 6800µF 16V -10% +50% - -
A763043 10000µF 16V -10% +50% - -
A763044 15000µF 16V -10% +50% - -
Compliance and certifications
certification
NFC
certification
DIN
certification
IEC
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Frequently Asked Questions

Find answers to the most frequently asked questions about our products and services.
How is Ceramic used in Capacitors ?

Ceramic chips are created with binders and solvents added to a specified ceramic powder. The slurry created is dried, forming a sheet or tape of ceramic material. Metal powder is mixed with solvents and additional ceramic material to create a liquid electrode. The liquid is then printed onto the ceramic layer. Layers of the ceramic sheets are stacked and laminated to form a solid structure.

The solid structure is cut into the desired size. Once cutting is complete, the assembly must be kiln fired. The temperature used in the firing process is critical in determining the capacitor’s characteristics. The process is similar for disc and chip styles. Disc capacitors use long leads to mount through circuit boards. Chips use surface mount technology.

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