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SH Series

Capacitors
|
Ceramic Capacitors
|
High-Q Microwave Capacitors
High voltage
Low ESR
RF Microwave / High-Q
product.thumbnail.alt SH Series - Capacitors > Ceramic Capacitors > High-Q Microwave Capacitors
  • Capacitance
0.2pF ~ 1000pF
  • Voltage Rated DC
25V ~ 1500V
  • Case size
1206, 1210, 1111, 0505, 0402, 0603, 0805
  • Tolerance
±1%, ±2%, ±5%, ±10%
  • Operating Temp
-55°C ~ 175°C
  • Mounting
SMD
  • RoHS
ROHS
  • Dielectric
NPO, NPO
Download Datasheet (10-2025)
@ CONTACT

For SHF and SHS: 0 ±30ppm/°C, –55°C to +150°C
For SHB: 0 ±30ppm/°C, –55°C to +175°C

 

Typical applications :

  • UHF, Microwave, RF power amplifiers
  • Filter networks
  • MRI coils
Compliance and certifications
certification
RoHS
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Frequently Asked Questions

Find answers to the most frequently asked questions about our products and services.
What are the specifications of the microwave tuning elements?

Tuning Elements consist of a brass mounting bushing with a rotor of the same material including a tuning rod made of metallic or dielectric or absorbent material and a nut.  

 

Metallic Tuning Elements consist of a brass mounting bushing with an integral tuning rotor of the same material and a nut. Bushing is gold plated, rotor and nut are passivated. Optional materials and plating are available upon request. 

How is Ceramic used in Capacitors ?

Ceramic chips are created with binders and solvents added to a specified ceramic powder. The slurry created is dried, forming a sheet or tape of ceramic material. Metal powder is mixed with solvents and additional ceramic material to create a liquid electrode. The liquid is then printed onto the ceramic layer. Layers of the ceramic sheets are stacked and laminated to form a solid structure.

The solid structure is cut into the desired size. Once cutting is complete, the assembly must be kiln fired. The temperature used in the firing process is critical in determining the capacitor’s characteristics. The process is similar for disc and chip styles. Disc capacitors use long leads to mount through circuit boards. Chips use surface mount technology.

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