FELSIC 125 FRS

High temperature
Low ESR
product.thumbnail.alt FELSIC 125 FRS - Capacitors > Aluminum Electrolytic Capacitors > Screw Terminals
  • High temperature
  • Low ESR
  • Capacitance
220µF ~ 150000µF
  • Voltage Rated DC
16V ~ 350V
  • Tolerance
-10% +50%
  • Operating Temp
-55°C ~ 125°C
  • Lifetime
3500 @ 125°C
  • RoHS
ROHS

The **FELSIC 125 FRS** series is an aluminum electrolytic capacitor manufactured to international standards integrating bank capacitor, very high reliability, high temperature, dc-dc converters, line-operated dc power supplies and energy storage. It offers optimal performance for applications requiring reliability and energy efficiency.
 

Typical applications :

  • Energy storage
  • Filtering
PN
Capacitance
Voltage Rated DC
Tolerance
Operating Temp
RoHS
A741200 10000µF 16V -10% +30% - -
A741201 15000µF 16V -10% +30% - -
A741202 22000µF 16V -10% +30% - -
A741203 33000µF 16V -10% +30% - -
A741204 47000µF 16V -10% +30% - -
A741205 68000µF 16V -10% +30% - -
A741206 100000µF 16V -10% +30% - -
A741207 150000µF 16V -10% +30% - -
A741220 4700µF 25V -10% +30% - -
A741221 10000µF 25V -10% +30% - -
A741222 15000µF 25V -10% +30% - -
A741223 22000µF 25V -10% +30% - -
A741224 33000µF 25V -10% +30% - -
Compliance and certifications
certification
NFC
certification
DIN
certification
IEC
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Main applications

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Frequently Asked Questions

Find answers to the most frequently asked questions about our products and services.
How is Ceramic used in Capacitors ?

Ceramic chips are created with binders and solvents added to a specified ceramic powder. The slurry created is dried, forming a sheet or tape of ceramic material. Metal powder is mixed with solvents and additional ceramic material to create a liquid electrode. The liquid is then printed onto the ceramic layer. Layers of the ceramic sheets are stacked and laminated to form a solid structure.

The solid structure is cut into the desired size. Once cutting is complete, the assembly must be kiln fired. The temperature used in the firing process is critical in determining the capacitor’s characteristics. The process is similar for disc and chip styles. Disc capacitors use long leads to mount through circuit boards. Chips use surface mount technology.

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